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Hey everyone, just wanted to share my latest build since I'm sure there are some 3D printing enthusiasts here like myself. I bought the parts for an MB6582 about 5 years ago, if you remember Meeblip was selling those 8580 SID chips and I picked up 8 of them, and then put everything into a box in a closet . 3D printing has come a very long way since the original MB6582 was created by Wilba. I read that the JB Weld solution may or may not be holding up great after all this time. Also, I wanted to use a Newhaven OLED which is much thinner than the original LCD. I thought there must be a solution to lower the gap distance so why not create some type of spacer for between the front panel and the PCB? I designed all parts in Fusion360. The PCB screws directly into the spacer using M2.5 nuts/screws and plastic screws. The top of it has a flange that rests in the panel groove for the PT-10. Total spacer height is 5.7mm which is the height of the base of the encoders. The front panel is another 1.25mm. Everything is printed out of ASA, which is very strong and heat resistant. I designed the panel graphics in Inkscape and printed on translucent vinyl. I used Davies knobs with small printed skirts to cover up the threads of the encoders since they were exposed. I do not have a vinyl autocutter but I do have an exacto and lots of patience Overall tried going with a 80s beige computer look. A build plate for my printer created the carbon fiber effect on the panel. I'm happy to share the 3D files if anyone could use them.

Hi all I am having a very hard time making any progress with a problem with my left LeMec board. When I first assembled the JA and LeMec boards and tested them, everything was working on JA board and the two LeMec boards except: - encoder 3 on left Lemec board was not registering depress events - encoder 8 on left LeMec board was generating garbage counter values when rotating. Since then I have gone backwards and been stuck for over several weeks with no progress. I first tried to solve the issues above with reflowing the ICs on left LeMec board but that didn't help. I then reflowed the ICs on the core, and after that, I am in this worse state with left LeMec board - encoder 8 does not register turns - none of the encoders are registering push events - 4 leftmost buttons on are not registering push events - 12 of the 16 LEDs light up immediately upon powering up as seen in attached pic I haven't bothered testing the Matias switch events as this is enough wrong already I have reflowed the ICs, diodes and transistors on that board multiple times, and on the core board too, and nothing is changing. The only advice I get from Midiphy is to reflow/check for dry joints/shorts which I have done over and over. It would help to have proper circuit diagrams to try to chase down likely culprits instead of messing with everything all the time. If I just connect the JA board to core and run the seq_l test, that is still testing fine for everything. The right LeMec board is out of the picture for now; I think it was all working well at least. Any help will be most welcome as I am close to assuming I just have to abandon this and write it off as a very expensive exercise in frustration and futility. Thanks Graham

This looks amazing! With some of the older chips like vintage vca, filter or delay chips you really have to be careful regarding heat and also (or even more so) static discharge. Nowadays with most ics these issues have long been solved by modern manufacturing processes and built in safety measures. I had to lear the hard way that this is not the case with chips from the 80s... So the heatsink is probably a good idea, as would be any way to allow for some airflow. On the other hand, i have removed the fans from some of my gear with no issues at all, as commercial units have to consider every worst case scenario (crowded rack in hot environment). So if you know how you use your gear you can get away with things that could not be allowed for every scenario.

Cool solution, looks great! The skirts for the knobs are a nice touch. One thing I wonder about is if heat would build up here, as the free air space in the case is less and the panel is also an insulator. The SIDs are on another PCB of course.