Just a few notes on SMT soldering. The process can be a whole lot quicker than THT, as you never need to clip a lead. It's true that you can't easily desolder chips, but the advice about hot air rework stations is sound. I've done the same before, even reusing 600 LEDs for the BLM. Practising on a test PCB is also smart.
The die inside a SOIC chip is probably the same as in a DIP. The package and leads are much smaller for SMT though, and with DIY you're normally socketing the ICs. So overheating is an issue. I suggest the "tack" method to anchor one corner, correcting the alignment then going down just one row at a time. Hold the soldering iron at a low angle (close to the PCB) if possible and heat the pad, then apply solder to the pin. This keeps the heat source away from the IC and uses surface tension to wick the solder in. I suggest against "drag soldering" as it's possible to scratch the soldermask.
For bridges, I've found an el cheapo solder sucker removes the excess quite well.