Psykhaze

More generally these are called IDC or IPC connectors : https://en.wikipedia.org/wiki/Insulation-displacement_connector .Depending on the "Pitch" , aka pin spacing , you will have different connectors (male/socket/Pinheader +female IDC on wire) . Traditional pin headers used in previous MBHP design have a pitch of 2.54mm/1mm imperial, wich is also the pitch of traditional DIP (through-hole) components. Most of MBHP pinheaders connectors are 2x05 so you can run a search with something like "2x05 IPC connector 2.54" or "2x05 ipc socket 2.54" Some common brands for connectors are Harwin,Samtec,Molex and Amphenol (at least i have some good experience with their products) But a search on Aliexpress/Ebay/Tayda might give you cheaper results Regards, Jerome

Also , Force sensing Sensors from Interlink might worth the look too to plug on AIN : https://www.interlinkelectronics.com/fsr-406. Then a silicon plane on top and you have a rubbered drumpad :) regards, Jerome

Hello, Nice "hardware" informations : https://www.edrums.info/ - https://www.toontrack.com/forum/e-drum-workshop/design-2z3z-choke-capable-cymbal-by-pfozz/#p46574 Regards, Jerome

Please stop flooding and complaining. Take your time to understand ucapps and wiki, read things and instead of triple posting make a consistent post instead. regards, Jerome

Hi Chris, maybe something like this might help ? : https://fr.aliexpress.com/item/STM32F4discovery-STM32F407VGT6-ARM-Cortex-M4-32bit-MCU-Core-Development-Board/32828318079.html , it's still bigger than your purposal that i would have preffered something like https://fr.aliexpress.com/item/Minimum-system-board-STM32F103RBT6-development-board-bottom-with-adapter-plate-Combo/32761293191.html to stay compatible with existant firmware/MCU used . But maybe still bigger that what you might expect. Hope it helped anyway :) regards, Jerome

Hi all , is it possible to have separated matrixes with the SRIO ? the special design i have in mind for example is having : [DIO-MATRIX]----[DINX*]----[DIO-MATRIX] modules linked together , like if for whatever routing reasons you have to handle encoders in middle of two matrixes of switches/ LEDs to stay modular for example. Any would say that the most easy would be to do [DIO-MATRIX]---[DIO-MATRIX]---[DINX*] to keep the matrix united but i wanted to know if the mentionned design might work? Also , is having 2 AOUT+ 2 AIN on the SPI port sounds acceptable ? wouldn't be the total data to handle becoming a bit big if you try to mux Analog ins to end with a 16 outs + 128 ins ? Thanks in advance for your answers, kind regards, Jerome

Ok thanks dudes , i think i will add the 0.1µF cap on encoders , the bunch of extra resistors and "switch cap" seems then not a real use.

Hi Folks, currently working on a Control Surface PCB driven by DIO i was wondering if such debouncing schems might help or if it was an overcome: Encoder: Switch: regards, Jerome

i'd recommand Code::Blocks , Cross-Platform and Easy to interface with any compilers

@ksir has redrawn the SeqV4 Wilba CS PCB over KiCAD for his personal use and everything was like working . Process documented over http://ksir-diy.blogspot.fr/2016/07/seq-v4.html Maybe you could kindly ask him to run a batch ? Regards, Jerome